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Packaging Predictable Assembly with Prediction-Enabled Component Technology

Technical Report
This report describes the major structures of a PECT. It then discusses the means of validating the predictive powers of a PECT so that consumers may obtain measurably bounded trust in design-time predictions.
Publisher

Software Engineering Institute

CMU/SEI Report Number
CMU/SEI-2001-TR-024
DOI (Digital Object Identifier)
10.1184/R1/6576023.v1

Abstract

This report describes the use of prediction-enabled component technology (PECT) as a means of packaging predictable assembly as a deployable product. A PECT results from integrating a component technology with one or more analysis technologies. Analysis technologies allow analysis and prediction of assembly-level properties prior to component assembly, and, presumably, prior to component acquisition. Analysis technologies also identify required component properties and their certifiable descriptions. This report describes the major structures of a PECT. It then discusses the means of validating the predictive powers of a PECT so that consumers may obtain measurably bounded trust in design-time predictions. Last, it demonstrates the above concepts in a simple but illustrative model problem: predicting average end-to-end latency of a soft real-time application built from off-the-shelf software components.

Cite This Technical Report

Hissam, S., Moreno, G., Stafford, J., & Wallnau, K. (2001, November 1). Packaging Predictable Assembly with Prediction-Enabled Component Technology. (Technical Report CMU/SEI-2001-TR-024). Retrieved May 24, 2024, from https://doi.org/10.1184/R1/6576023.v1.

@techreport{hissam_2001,
author={Hissam, Scott and Moreno, Gabriel and Stafford, Judith and Wallnau, Kurt},
title={Packaging Predictable Assembly with Prediction-Enabled Component Technology},
month={Nov},
year={2001},
number={CMU/SEI-2001-TR-024},
howpublished={Carnegie Mellon University, Software Engineering Institute's Digital Library},
url={https://doi.org/10.1184/R1/6576023.v1},
note={Accessed: 2024-May-24}
}

Hissam, Scott, Gabriel Moreno, Judith Stafford, and Kurt Wallnau. "Packaging Predictable Assembly with Prediction-Enabled Component Technology." (CMU/SEI-2001-TR-024). Carnegie Mellon University, Software Engineering Institute's Digital Library. Software Engineering Institute, November 1, 2001. https://doi.org/10.1184/R1/6576023.v1.

S. Hissam, G. Moreno, J. Stafford, and K. Wallnau, "Packaging Predictable Assembly with Prediction-Enabled Component Technology," Carnegie Mellon University, Software Engineering Institute's Digital Library. Software Engineering Institute, Technical Report CMU/SEI-2001-TR-024, 1-Nov-2001 [Online]. Available: https://doi.org/10.1184/R1/6576023.v1. [Accessed: 24-May-2024].

Hissam, Scott, Gabriel Moreno, Judith Stafford, and Kurt Wallnau. "Packaging Predictable Assembly with Prediction-Enabled Component Technology." (Technical Report CMU/SEI-2001-TR-024). Carnegie Mellon University, Software Engineering Institute's Digital Library, Software Engineering Institute, 1 Nov. 2001. https://doi.org/10.1184/R1/6576023.v1. Accessed 24 May. 2024.

Hissam, Scott; Moreno, Gabriel; Stafford, Judith; & Wallnau, Kurt. Packaging Predictable Assembly with Prediction-Enabled Component Technology. CMU/SEI-2001-TR-024. Software Engineering Institute. 2001. https://doi.org/10.1184/R1/6576023.v1