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Call for Papers: International Conference on Technical Debt (TechDebt 2019)

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The Second International Conference on Technical Debt will be held in Montréal, QC, Canada, on May 26-27, 2019, collocated with ICSE 2019. The conference brings together leading software researchers, practitioners, and tool vendors to explore theoretical and practical approaches that manage technical debt.

Technical debt describes a universal software development phenomenon: design or implementation constructs that are expedient in the short term, but set up a technical context that can make future change more costly or impossible. Developers and managers use the concept to communicate key tradeoffs related to release and quality issues. As the interest in technical debt from our industry steadily grows, the TechDebt Conference serves as the key venue to share successful analysis and management approaches used in software development organizations, emerging practices, and research results.

We invite submissions for research, industry, and position and future-trend papers on all topics relevant to technical debt, such as

  • identification, visualization, and analysis
  • metrics and economic models for measuring and reasoning about technical debt
  • relationship of technical debt to quality attributes, DevOps, testing and requirements engineering, and software evolution
  • relationship to software lifecycle activities
  • concrete practices and tools

Important Dates

  • January 15: Abstract submitted to EasyChair
  • January 22: Full papers entered in EasyChair
  • March 1: Notification of acceptance/rejection
  • March 15: Camera-ready submission of final paper

For more information about submitting a paper, see the Call for Papers.

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