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Call for Papers: International Conference on Technical Debt (TechDebt 2018)

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TechDebt 2018

The inaugural edition of the International Conference on Technical Debt in conjunction with International Conference on Software Engineering (ICSE) 2018

MAY 27-28, 2018 | Gothenburg, Sweden

THE INTERNATIONAL CONFERENCE ON TECHNICAL DEBT will bring together leading software researchers, practitioners, and tool vendors to explore theoretical and practical approaches that manage technical debt.

Technical debt describes a universal software development phenomenon: design or implementation constructs that are expedient in the short term, but set up a technical context that can make future change more costly or impossible. Developers and managers use the concept to communicate key tradeoffs related to release and quality issues.

Interest and engagement from the software engineering community has steadily grown. A working conference has become essential.

We invite submissions for research, industry, and position and future-trend papers on all topics relevant to technical debt, such as

  • identification, visualization, and analysis
  • metrics and economic models for measuring and reasoning about technical debt
  • technical debt in code, designs and architecture, and development infrastructure
  • relationship to software lifecycle activities
  • concrete practices and tools

Important Dates

  • January 15--Abstract
  • January 22--Full paper
  • March 1--Notification
  • March 15--Camera ready

For more information about submitting a paper, see the Call for Papers.

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Bill Pollak

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