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Call for Research and Industry Papers, 17th International Software Product Line Conference (SPLC 2013)

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Call for Research Papers

17th International Software Product Line Conference (SPLC 2013) Tokyo, Japan 26-30 August 2013 http://www.splc2013.net/ SPLC, the premier forum where practitioners, researchers and educators can present and discuss the most recent ideas, innovations, trends, experiences, and concerns in the area of software product lines and software product family engineering invites you to come to Tokyo Japan. We invite a range of topics related to software product line engineering, both traditional and those that have not yet been addressed.

Special theme of SPLC 2013 is SPL adoption: forms, success factors and roadblocks These topics include but are not limited to

  • Industrial experiences in product line engineering
  • Requirements management for product lines
  • Techniques and tools for product line engineering
  • Evolution and life-cycle issues of product line assets
  • Business issues for product lines
  • Organizational and process issues for product lines
  • Product line engineering for globalization
  • Empirical studies in product line engineering
  • Software product lines and COTS components, open-source
  • Software product lines everywhere
  • Open source SPLs
  • SPL and service-oriented computing
  • SPLs and social networks
Submissions: We invite the following categories of contributions:
  1. Research papers: describe original and unpublished results of empirical, conceptual, experimental, and theoretical research in the field of software product line engineering. We also call for short research papers, which are intended to report ideas in their early stages.
  2. Vision papers: describe emerging technical/business directions relevant to software product lines and software reuse. They also describe research challenges along with possible approaches for them.
Page limit is 10 pages for full papers and 5 pages for short papers for all the categories of contributions. Submissions should follow the ACM SIGS proceedings format and will be reviewed by at least three members of the SPLC 2013 program committee. Easychair submission link: https://www.easychair.org/conferences/?conf=splc2013 ------------------------------------------------------------ Important Dates: Abstract Submission deadline: February 15th, 2013 Full paper submission deadline: February 22nd, 2013 Notification: April 13th, 2013 ------------------------------------------------------------ For more information about the conference, please visit the conference page at http://www.splc2013.net/ Program Chairs: Stefania Gnesi ISTI-CNR, Italy Stanislaw Jarzabek National University of Singapore ======================================================================

Call for Industry Papers

17th International Software Product Line Conference (SPLC 2013) Tokyo, Japan 26-30 August 2013 http://www.splc2013.net/ For more than a decade, organizations have been taking advantage of software product line engineering (PLE) to achieve business advantages in time to market, cost, quality, and agility. These organizations' wide range of challenges, successes and adaptations can serve as valuable lessons for other organizations and can provide direction to academia about which problems require additional research. We seek contributions from industry those challenges, successes, and adaptations during all stages of PLE. We encourage you to share your experience (not only great success stories, but also lessons leant from failures!) with the industrial and academic community at SPLC 2013 in the following areas:
  • Introducing PLE to an organization
  • Business case analysis
  • Organizational and process issues for product lines
  • Scoping of product/solution portfolios and assets
  • Product line architecture
  • Variability management in and between all stages of the life-cycle
  • Product line testing
  •  … and all kinds of lessons learnt in industrial setting
Page limit is 10 pages for full papers and 5 pages for short papers. Submissions should follow the ACM SIGS proceedings format and will be reviewed by at least three members of the SPLC 2013 industry program committee. For more information you can visit the SPLC 2013 web site. ------------------------------------------------------------ Important Dates: Abstract Submission deadline: February 15th, 2013 Full paper submission deadline: February 22nd, 2013 Notification: April 13th, 2013 ------------------------------------------------------------ For more information about the conference, please visit the conference page at http://www.splc2013.net/ Industry Track Chair: Natsuko Noda NEC Corporation, Japan

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Bill Pollak

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